Difference between revisions of "Photoresist"

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(Created page with 'The following resists are used in the Fab Lab: PMMA BPO')
 
 
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Photoresists are used to coated and pattern substrates.  They are normally
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spincoated and patterned by exposing to UV light in the [[mask aligner]] (through a [[mask]]).
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They come in postive and negative varieties.  In a positive resist holes are made in the film where it has been exposed to UV light, in a negative resist holes are made where it hasn't been exposed to UV light.
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The following resists are used in the Fab Lab:
 
The following resists are used in the Fab Lab:
  
[[PMMA]]
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[[PMMA]] negative
[[BPO]]
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[[BPO]] positive

Latest revision as of 11:32, 5 May 2010

Photoresists are used to coated and pattern substrates. They are normally spincoated and patterned by exposing to UV light in the mask aligner (through a mask).

They come in postive and negative varieties. In a positive resist holes are made in the film where it has been exposed to UV light, in a negative resist holes are made where it hasn't been exposed to UV light.

The following resists are used in the Fab Lab:

PMMA negative

BPO positive